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www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 14 ? 001 1/11 21.mar.2013.rev.003 datasheet cmos ldo regulator series for portable equipments versatile package full cmos ldo regulator buxxua3wnvx series general description buxxua3wnvx series is high-performance full cmos regulator with 300-ma output, which is mounted on versatile package sson004x1010 (1.00mm 1.00 mm 0.60mm). it has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 50 a. it is most appropriate for various applications such as power supplies for logic ic, rf, and camera modules.rohm?s. features ? high accuracy detection ? low current consumption ? compatible with small cera mic capacitor (cin=co=1.0uf) ? with built-in output discharge circuit ? high ripple rejection ? on/off control of output voltage ? with built-in over current protection circuit and thermal shutdown circuit ? low dropout voltage typical application circuit key specifications ? output voltage: 1.0v to 3.7v ? accuracy output voltage: 1.0% (25mv) ? low current consumption: 50 a ? operating temperature range: -40c to +85c applications battery-powered portable equipment, etc. package sson004x1010 : 1.00mm x 1.00mm x 0.60mm fig.1 application circuit product structure:silicon monolithic integrated circuit this product is not designed protection against radioactive rays. stby vin gnd stby gnd gnd vout vout vin
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 2/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet connection diagram pin descriptions ordering information 1 vout 2 gnd 3 stby 4 vin sson004x1010 (top view) part number marking lot number 1pin mark 1 2 sson004x1010 pin no. symbol function 1 vout output voltage 2 gnd grouding 3 stby on/off control of output voltage (high: on, low: off) 4 vin power supply voltage bux xua3 w nvx- t l part output voltage low dropout voltage with package packageing and forming specification number 10 : 1.0v maximum output current output discharge nvx : sson 004x1010 embossed tape and reel 300ma tl : the pin number 1 is the lower left 37 : 3.7v sson004x1010 (unit : mm ) 1.00.1 1.00.1 1pin mark 0.6max 0.02 +0.03 ?0.02 s 0.05 (0.12) 0.650.05 0.480.05 0.070.1 0.250.05 0.250.1 1 45 4 2 3 3-c0.18 r0.05 0. 480.05 0.320.1 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the left hand 5000pcs tl () direction of feed reel 1pin
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 3/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet lineup absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage vmax -0.3 +6.0 v power dissipation pd 560(*1) mw maximum junction temperature tjmax +125 operating temperature range topr -40 +85 storage temperature range ts t g - 5 5 +125 ( * 1)pd deleted at 5.6mw/ at temperatures above ta=25 , mounted on 70701.6 mm glass-epoxy pcb. recommended operating range (not to exceed pd) parameter symbol limit unit power supply voltage vin 1.7 5.5 v maximum output current imax 300 ma operating conditions (*2)make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, dc bias, changing as time progresses characteristi c. parameter symbol min. typ. max. unit condition input capacitor cin 0.47(*2) 1.0 - f ceramic capacitor recommended output capacitor co 0.47(*2) 1.0 - f ( * )under development marking e ml (*) nl (*) ul (*) yl (*) al (*) ql (*) tbd (*) tbd (*) tbd (*) output voltage 1.0v 1.05v 1.1v 1.15v 1.2v 1.25v 1.3v 1.35v 1.4v 1.45v part number bu10 bu1a bu11 bu1b bu12 bu1c bu13 bu1d bu14 bu1e f tbd (*) tbd (*) tbd (*) tbd (*) tbd (*) g bl (*) dl (*) tbd (*) el (*) 1.5v 1.55v 1.6v 1.65v 1.7v 1.75v 1.8v 1. 85v 1.9v 1.95v 2.0v bu15 bu1f bu16 bu1g bu17 bu1h bu18 bu 1j bu19 bu1k bu20 fl (*) gl (*) tbd (*) rl (*) tbd (*) hl (*) tbd (*) tbd (*) tbd (*) h tbd (*) 2.05v 2.1v 2.15v 2.2v 2.25v 2.3v 2.35v 2.4v 2.45v 2.5v 2.55v bu2a bu21 bu2b bu22 bu2c bu23 bu2d bu24 bu2e bu25 bu2f m (*) tbd (*) ul (*) yl (*) n (*) q (*) u (*) 0i (*) k tbd (*) 1i (*) 2.6v 2.65v 2.7v 2.75v 2.8v 2.85v 2.9v 2. 95v 3.0v 3.05v 3.1v bu26 bu2g bu27 bu2h bu28 bu2j bu29 bu2k bu30 bu3a bu31 tbd (*) 2i (*) tbd (*) y (*) tbd (*) 3i (*) tbd (*) tbd (*) tbd (*) tbd (*) tbd (*) 3.15v 3.2v 3.25v 3.3v 3.35v 3.4v 3.45v 3.5v 3.55v 3.6v 3.65v bu3b bu32 bu3c bu33 bu3d bu34 bu3e bu 35 bu3f bu36 bu3g 9 (*) tbd (*) tbd (*) tbd (*) tbd (*) tbd (*) tbd (*) 3.7v 3.75v 3.8v 3.85v 3.9v 3.95v 4.0v bu37 bu3h bu38 bu3j bu39 bu3k bu40
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 4/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet electrical characteristics (ta=25, vin=vout+1.0v (*3), stby=vin, cin=1.0f, co=1.0f, unl ess otherwise noted.) this product is not designed for protection against radioactive rays. (*3) vin=2.5v for voutQ1.5v (*4) vin=2.5v to 5.5v for voutQ1.5v block diagrams parameter symbol limit unit conditions min. typ. max. overall device output voltage 1 vout1 vout0.99 vout vout1.01 v iout=10avoutR2.5v vout-25mv vout+25mv iout=10avout2.5v operating current iin - 50 90 a iout=0ma operating current (stby) istby - - 1.0 a stby=0v ripple rejection ratio rr 45 70 - db vrr=-20dbv,frr=1khz,iout=10ma, vin=3.6v dropout voltage vsat - 470 700 mv 1.0vQvout1.2v(iout=300ma) - 350 500 mv 1.2vQvout1.5v(iout=300ma) - 280 380 mv 1.5vQvout1.7v(iout=300ma) - 250 320 mv 1.7vQvout2.1v(iout=300ma) - 220 260 mv 2.1vQvout2.5v(iout=300ma) - 200 220 mv 2.5vQvout(iout=300ma) line regulation vdl - 2 20 mv vin=vout+1.0v to 5.5v(*4), iout=1 0a load regulation vdlo - 25 45 mv iout=0.01ma to 300ma over-current protection (ocp) limit current ilmax 305 550 - ma vo=vout*0.95 short current ishort 50 150 300 ma vo=0v standby block discharge resistor rdsc 20 50 80 vin=5.5v, stby=0v, vout=2.6v stby pin pull-down current istb 0.1 0.9 8.0 a stby=1.5v stby control voltage on vstbh 1.2 - 5.5 v off vstbl -0.3 - 0.3 v output voltage 2 vout2 1.7 1.8 1.9 v vin=2.375v to 2.625v vout=1.8v, iout=0.01ma to 300ma, ta=-4085 cin???1.0 f (ceramic) co ???1.0 f (ceramic) 4 3 1 2 cin vin gnd stby stby vout vout co vref ocp stby discharge tsd vin fig. 2 block diagrams
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 5/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet z reference data bu18ua3wnvx (ta=25oc unless otherwise specified.) fig. 3 fig. 4 fig. 5 fig. 6 fig. 8 fig. 7 lineregulation 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 2.02.12.22.32.42.52.62.72.82.93.03.13.23.33.43.53.6 vin[v] vout[v] 85 25 -40 vout=1.8v iout=10ma lineregulation 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 2.02.12.22.32.42.52.62.72.82.93.03.13.23.33.43.53.6 vin[v] vout[v] 85 25 -40 vout=1.8v iout=300ma load regulation 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 0 50 100 150 200 250 300 iout[ma] vout[v] 85 25 -40 vout=1.8v output voltage vs temperature 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 -40-200 20406080 temperature[] vout[v] 10ma 150ma 300m a vout=1.8v ground pin current vs input voltage 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 2.3 2.5 2.7 2.9 3.1 3.3 3.5 vin[v] ignd[ua] 85 25 -40 vout=1.8v ground pin current vs load 0 50 100 150 200 250 300 350 400 450 0 50 100 150 200 250 300 iout[ma] ignd[ua] 85 25 -40 vout=1.8v
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 6/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet z reference data bu18ua3wnvx (ta=25oc unless otherwise specified.) ground pin current vs temperature 0 10 20 30 40 50 60 70 -40 -20 0 20 40 60 80 temperature[] ignd[ua] vout=1.8v fig. 12 fig. 11 fig. 10 fig. 9 vout=1.8v 0ma 200ma iout vout trise=tfall=1us 10s/div 100ma/di v 100mv/di v load transient response vout=1.8v 0ma 10ma iout vout trise=tfall=1us 10s/div 20ma/di v 100mv/di v load transient response fig. 14 fig. 13 current limit vs input voltage 0 100 200 300 400 500 600 700 2.3 2.5 2.7 2.9 3.1 3.3 3.5 vin[v] ilim[ma] 85 25 -40 vout=1.8v power-supply ripple rejection vs frequency 0 10 20 30 40 50 60 70 80 90 100 10 100 1000 10000 100000 1000000 frequency[hz] psrr[db] 10ma 150m a shutdown current vs input voltage 0 10 20 30 40 50 60 70 80 90 100 2.3 2.5 2.7 2.9 3.1 3.3 3.5 vin[v] ishdn[na] 85 25 -40 vout=1.8v
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 7/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet z reference data bu18ua3wnvx (ta=25oc unless otherwise specified.) vout=1.8v 0ma 50ma iout vout trise=tfall=1us 10s/div 50ma/di v 100mv/di v load transient response vout=1.8v 0ma 300ma iout vout trise=tfall=1us 10s/div 200ma/di v 100mv/di v load transient response fig. 16 fig. 15 fig. 17 2.3v 2.9v vin vout slew rate = 0.5v/s vout=1.8v iout=300ma 1ms/div 1v/di v 100mv/di v line transient response 2.3v 2.9v vin vout slew rate = 0.5v/s vout=1.8v iout=1ma 1ms/div 1v/di v 100mv/di v line transient response 2.1v 3.6v vin vout slew rate = 0.5v/s vout=1.8v iout=300ma 1ms/div 1v/di v 100mv/di v line transient response vin vout vout=1.8v iout=1ma 200ms/div 1v/di v vin ramp up, ramp down response fig. 20 fig. 19 fig. 18
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 8/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet z reference data bu18ua3wnvx (ta=25oc unless otherwise specified.) fig. 21 vout=1.8v iout=0ma cout=1.0uf 0v stby vout 20s/div 1v/di v start up time 1v/di v 1.5v 1v/di v 1v/di v 40s/div 0v stby vout 1.5v vout=1.8v iout=0ma cout=1.0uf discharge time fig. 22
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 9/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet z about power dissipation (pd) as for power dissipation, an approximate estimate of the hea t reduction characteristics and internal power consumption of ic are shown, so please use these for reference. sinc e power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wi ring rate, number of layers and through holes, etc.), it is recommended to measure pd on a set board. exceeding the po wer dissipation of ic may lead to deterioration of the original ic performance, such as causin g operation of the thermal shutdown circui t or reduction in current capability. therefore, be sure to prepare sufficient ma rgin within power dissipation for usage. calculation of the maximum internal power consumption of ic (pmax) pmax=(vin-vout)iout(max.) (vin: input voltage vout: output voltage iout(max): maximum output current) { measurement conditions standard rohm board evaluation board 1 layout of board for measurement ic implementation position top layer (top view) top layer (top view) bottom layer (top view) bottom layer (top view) measurement state with board implemented (wind spee d 0 m/s) with board implemented (wind speed 0 m/s) board material glass epoxy resin (double-side board) glass epoxy resin (double-side board) board size 70 mm x 70 mm x 1.6 mm 40 mm x 40 mm x 1.6 mm wiring rate top layer metal (gnd) wiring rate: approx. 0% metal (gnd) wiring rate: approx. 50% bottom layer metal (gnd) wiring rate: approx. 50% metal (gnd) wiring rate: approx. 50% through hole diameter 0.5mm x 6 holes diameter 0.5mm x 25 holes power dissipation 0.56w 0.39w thermal resistance ja=178.6c/w ja=256.4c/w * please design the margin so that pmax becomes is than pd (pmax < pd) within the usage temperature range fig. 23 sson004x1010 power dissipation heat reduction characteristics (reference) 0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 ta [ =? ] pd [w] 0.56w 85 0.39w
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 10/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet operation notes 1.) absolute maximum ratings use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. 2.) gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. never connect a potential lower than gnd to any pin, even if only transiently. 3.) thermal design use a thermal design that allows for a sufficient margin for that package power dissipation rating (pd) under actual operating conditions. 4.) inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting or shorts between pins may result in damage to the ic. 5.) operation in strong electromagnetic fields strong electromagnetic fields may cause the ic to malfunction. caution should be exercised in applications where strong electromagnetic fields may be present. 6.) common impedance wiring traces should be as short and wide as possible to minimi ze common impedance. bypass capacitors should be use to keep ripple to a minimum. 7.) voltage of stby pin to enable standby mode for all channels, set the stby pin to 0.3 v or less, and for normal operation, to 1.2 v or more. setting stby to a voltage between 0.3 and 1.2 v may cause malfunction and should be avoided. keep transition time between high and low (or vice versa) to a minimum. additionally, if stby is shorted to vin, the ic will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. if the ic is switched on again while this voltage is pr esent, overshoot may occur on the output. therefore, in applications where these pins are shorted, the output should always be completely discharg ed before turning the ic on. 8.) over-current protection circuit (ocp) this ic features an integrated over-current and short-protection circuitry on the output to prevent destruction of the ic when the output is shorted. the ocp circuitry is designed only to protect the ic from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. therefore, applications should not be designed under the assumption that this circuitry will engag e. 9.) thermal shutdown circuit (tsd) this ic also features a thermal shutdown circuit that is design ed to turn the output off when the junctio n temperature of the ic exceeds about 150. this feature is intended to protect the ic only in the even t of thermal ove rload and is not designed to guarantee operation or act as an active security device for the application. therefore, applications should not be designe d under the assumption that this circuitry will engage. 10.) input/output capacitor capacitors must be connected between the input/output pins and gnd for stable operation, and should be physically mounted as close to the ic pins as possible (refer to figure 4). the input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with long or winding power supply traces. the output capacitance value is directly related to the overall stability and transient response of the regulator, and should be set to the largest possible value for the application to increase these characteristics. during desig n, keep in mind that in general, cer amic capac itors have a wide range of tolerances, temperature coefficients and dc bias characteristics, and that their capacitance values tend to decrease over time. confirm these details before choosing appropriate capacitors for your application.(please refer the technical note, regarding ceramic capacitor of recommendation) 11.) about the equivalent series resistance (esr) of a ceramic capacitor capacitors generally have esr (equivalent series resistance) and it operates stably in the esr-iout area shown on the right. since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different esr, please check the esr of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. fig. 24 stable region (example) unstable region cout=1.0uf cin=1.0uf temp=25 0.01 0.1 1 10 100 0 100 200 300 400 iout[ma] esr[] stable unstable
www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300040-1-2 tsz22111 ? 15 ? 001 11/11 21.mar.2013.rev.003 buxxua3wnvx series datasheet revision history date revision changes 31.jan.2013 001 new release 20.feb.2013 002 package size is changed. 21.mar.2013 003 adding a revision history adding a lineup the condition of drop voltage is changed. the range of shutdown current vs input voltage is changed. the minimum value of limit current is changed.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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